GB/T 8646-1998Fine aluminum-1% silicon wire for semiconductor lend-bonding (English PDF)
半导体键合铝-1%硅细丝
GB/T 8646 | Evolution and historical versions
| Std ID | Title | Status |
|---|---|---|
| YS/T 543-2024 | Obsolete | |
| YS/T 543-2015 | Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding | Obsolete |
| YS/T 543-2006 | Fine aluminum-1% silicon wire for semiconductor lend-bonding | Obsolete |
| GB/T 8646-1998 | Fine aluminum-1% silicon wire for semiconductor lend-bonding | Obsolete |
GB/T 8646-1998 is obsolete. It has been replaced by YS/T 543-2006. This page sells the obsolete edition, for projects and contracts that still cite it.
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Issued by
State Quality Technical Supervision Bureau
Level / Type
National · Recommended
Issue date
July 15, 1998
Implementation date
February 1, 1999
Scope
GB/T 8646-1998 is the English-translated version of 半导体键合铝-1%硅细丝.
GB/T 8646-1998 is the Chinese national standard "Fine aluminum-1% silicon wire for semiconductor lend-bonding". It was issued on July 15, 1998 by the State Quality Technical Supervision Bureau, and took effect on February 1, 1999. It is obsolete: it has been replaced by YS/T 543-2006.
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Document preview — GB/T 8646-1998
National Standard of the People's Republic of China
Issued by: State Quality Technical Supervision Bureau
Contents
- Document data
1 Document data
Sector: National standard (Recommended).
Issuing body: State Quality Technical Supervision Bureau.
Date of issue: 1998-07-15.
Date of implementation: 1999-02-01.
Status: obsolete, replaced by YS/T 543-2006.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — all pages — is available in the English PDF.
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GB/T 8646-1998
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