GB/T 4937.31-2023Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices(internally induced) (English PDF)

foreword

This document is in accordance with the provisions of GB/T 1:1-2020 "Guidelines for Standardization Work Part 1: Structure and Drafting Rules for Standardization Documents"

drafting:

This document is part 31 of GB/T 4937 "Mechanical and Climate Test Methods for Semiconductor Devices": GB/T 4937 has been issued

The following sections:

--- Part 1: General;

--- Part 2: Low pressure;

--- Part 3: External visual inspection;

--- Part 4: Highly Accelerated Steady State Damp Heat Test (HAST);

--- Part 11: Rapid temperature change double tank method;

--- Part 12: Frequency sweep vibration;

--- Part 13: Salt spray;

--- Part 14: Terminal strength (lead fastness);

--- Part 15: Resistance to soldering heat of through-hole mounted devices;

--- Part 17: Neutron irradiation;

--- Part 18: Ionizing radiation (total dose);

--- Part 19: Chip shear strength;

--- Part 20: Plastic-encapsulated surface mount devices are resistant to the combined effects of moisture and soldering heat;

--- Part 20-1: Handling, packaging, marking and transportation of surface mount devices sensitive to the combined effects of moisture and soldering heat;

--- Part 21: Solderability;

--- Part 22: Bonding strength;

--- Part 23: High temperature working life;

--- Part 26: Electrostatic discharge (ESD) susceptibility test Human body model (HBM);

--- Part 27: Electrostatic discharge (ESD) susceptibility test machine model (MM);

--- Part 30: Pretreatment of non-hermetic surface mount devices before reliability tests;

--- Part 31: Flammability of plastic encapsulated devices (internal causes);

--- Part 32: Flammability of plastic encapsulated devices (external causes);

--- Part 42: Temperature and humidity storage:

This document is equivalent to IEC 60749-31:2002 "Mechanical and climatic test methods for semiconductor devices - Part 31: Plastic encapsulated devices

Flammability (Internally Induced)":

A chapter "Terms and Definitions" has been added to this document:

Please note that some contents of this document may refer to patents: The issuing agency of this document assumes no responsibility for identifying patents:

Introduction

Semiconductor devices are common basic products in the electronics industry chain and are the most basic units in electronic systems: GB/T 4937 "Semiconductors

Mechanical and Climatic Test Methods for Bulk Devices" is the basic and universal standard for testing semiconductor devices:

The quality and reliability of the device play an important role, and it is proposed to be composed of 44 parts:

--- Part 1: General: The purpose is to specify general guidelines for mechanical and climatic test methods for semiconductor devices:

--- Part 2: Low air pressure: The purpose is to detect the ability of components and materials to avoid electrical breakdown failure:

--- Part 3: External visual inspection: The purpose is to detect whether the material, design, structure, marking and process quality of semiconductor devices meet the

Purchasing Documentation Requirements:

--- Part 4: Strongly Accelerated Steady State Damp Heat Test (HAST): The purpose is to specify the highly accelerated steady state damp heat test (HAST) to detect

Test the reliability of non-hermetic packaged semiconductor devices in humid environment:

--- Part 5: Steady-state temperature and humidity bias life test: The purpose is to specify the steady-state temperature and humidity bias life test to detect non-airtight

Reliability of packaged semiconductor devices in wet environments:

--- Part 6: High temperature storage: The purpose is to detect the influence of high temperature storage on semiconductor devices without applying electrical stress:

--- Part 7: Internal water vapor measurement and other residual gas analysis: The purpose is to detect the quality of the packaging process and provide relevant

information on the long-term chemical stability of the body in the shell:

--- Part 8: Sealing: The purpose is to detect the leak rate of semiconductor devices:

--- Part 9: Sign durability: The purpose is to test the durability of marks on semiconductor devices:

--- Part 10: Mechanical shock: The purpose is to test the suitability of semiconductor devices and printed board assemblies to withstand moderately severe shocks

ability:

--- Part 11: Rapid temperature change double tank method: The purpose is to specify the rapid temperature change of semiconductor devices (double tank method)

Test procedures, failure criteria, etc:

--- Part 12: Frequency sweep vibration: The purpose is to detect the impact of vibration on semiconductor devices within the specified frequency range:

--- Part 13: Salt spray: The purpose is to detect the corrosion resistance of semiconductor devices:

--- Part 14: Terminal strength (lead fastness): The purpose is to detect the lead/package interface of semiconductor devices and the firmness of leads:

Solidity:

--- Part 15: Resistance to soldering heat of through-hole mounted devices: The purpose is to test the tolerance of through-hole mounted solid-state packaged semiconductor devices

Ability to heat stress generated by wave soldering or soldering iron soldering leads:

--- Part 16: Particle collision noise detection (PIND): The purpose is to specify the detection of free particles in cavity devices

method:

--- Part 17: Neutron irradiation: The purpose is to examine the susceptibility of semiconductor devices to performance degradation in a neutron environment:

--- Part 18: Ionizing radiation (total dose): The purpose is to specify the requirements for evaluating the effects of low dose rate ionizing radiation on semiconductor devices:

Accelerated annealing test method:

--- Part 19: Chip shear strength: The purpose is to detect the materials and

Integrity of process steps:

--- Part 20: Plastic surface mount devices resistance to combined effects of moisture and soldering heat: The purpose is to simulate storage in a warehouse or

Moisture absorbed by plastic-encapsulated surface-mounted semiconductor devices in a dry packaging environment, and then evaluated for their resistance to soldering heat:

--- Part 20-1: Handling, packaging, marking and transportation of surface mount devices sensitive to the combined effects of moisture and soldering heat: Purpose

It is to regulate the operation, packaging, transportation and use of plastic-encapsulated surface-mounted semiconductor devices that are sensitive to the combined effects of moisture and soldering heat

method:

--- Part 21: Solderability: The purpose is to specify the lead-out terminals of component packages that are soldered with lead-tin solder or lead-free solder

The solderability test procedure:

--- Part 22: Bonding strength: The purpose is to detect the bonding strength of semiconductor devices:

--- Part 23: High temperature working life: The purpose is to specify the effects of bias conditions and temperature on solid-state devices over time:

experiment method:

--- Part 24: Accelerated humidity unbiased strong accelerated stress test: The purpose is to detect non-hermetically packaged solid-state devices in wet

reliability in the environment:

--- Part 25: Temperature cycle: The purpose is to detect semiconductor devices, components and circuit board assemblies subjected to extreme high temperatures and extreme

The ability of low temperature alternating action to induce mechanical stress:

--- Part 26: Electrostatic discharge (ESD) susceptibility test Human body model (HBM): The purpose is to specify reliable, repeatable

HBMESD test method:

--- Part 27: Electrostatic discharge (ESD) susceptibility test machine model (MM): The purpose is to specify reliable, repeatable

MMESD test method:

--- Part 28: Electrostatic discharge (ESD) susceptibility testing Charged Device Model (CDM) device level: The purpose is to provide

Reliable and repeatable CDMESD test method:

--- Part 29: Latch-up test: The purpose is to specify the method of detecting the latch-up characteristics of integrated circuits and the failure criterion of the latch:

--- Part 30: Pretreatment of non-hermetic surface mount devices before reliability testing: Intended to specify unsealed surface mount

Standard procedure for device preconditioning before reliability testing:

--- Part 31: Flammability of plastic encapsulated devices (internal causes): The purpose is to detect whether the plastic packaged device is caused by overload

Internal heat and burning:

--- Part 32: Flammability of plastic encapsulated devices (external causes): The purpose is to detect whether the plastic packaged device is caused by external heating

into burning:

--- Part 33: Accelerated moisture-resistant unbiased high-pressure cooking: The purpose is to identify the internal failure mechanisms of semiconductor device packages:

--- Part 34: Power cycle: The purpose is to reduce the

Test the thermal and mechanical stress resistance of semiconductor devices:

--- Part 35: Acoustic microscopy of plastic packaged electronic components: The purpose is to specify the acoustic microscope for plastic-encapsulated electronic components

A method for detecting defects (laminations, cracks, voids, etc:) in parts:

--- Part 36: Steady-state acceleration: The purpose is to specify the test method for the steady-state acceleration of cavity semiconductor devices in order to detect their junction

Structural and mechanical type defects:

--- Part 37: Board-level drop test methods using accelerometers: The purpose is to specify the board level drop test using accelerometer

method, the drop test of surface mount devices can be repeatedly detected, and the common failure modes during product level testing can be reproduced at the same time:

--- Part 38: Soft error test methods for semiconductor devices with memory: The purpose is to specify the semiconductor device with storage

Test method for soft error susceptibility in high energy particle environments (eg alpha radiation):

--- Part 39: Measurement of moisture diffusivity and water solubility of organic materials for semiconductor devices: The purpose is to specify the application of semi-

Method for measuring the moisture diffusivity and water solubility of organic materials used in the encapsulation of conductive devices:

--- Part 40: Board-level drop test methods using strain gauges: The purpose is to specify the board level drop test method using strain gauges:

This method enables repeatable testing of surface mount device drop tests while reproducing common failure modes during product-level testing:

--- Part 41: Non-volatile memory reliability test methods: The purpose is to specify the effective endurance, data

According to the requirements of maintenance and temperature cycle test:

--- Part 42: Temperature and humidity storage: The purpose is to specify the test method for testing the ability of semiconductor devices to withstand high temperature and high humidity environments:

--- Part 44: Neutron irradiation single event effects (SEE) test methods for semiconductor devices: The purpose is to specify the detection of high-density set

Test method for single event effect (SEE) of integrated circuits:

GB/T 4937 (all parts) is a one-to-one correspondence with IEC 60749 (all parts) to ensure that the test methods of semiconductor devices are consistent with those of the national

Consistent with international standards, to achieve semiconductor device inspection methods, reliability evaluation, and quality levels in line with international standards: Through the development of this standard, it is determined that the unified

The test method and stress, and improve the standard system of semiconductor devices:

Mechanical and climatic test methods for semiconductor devices

Part 31: Flammability of plastic encapsulated devices (internal origin)

1 Scope

This document applies to semiconductor devices (discrete devices and integrated circuits), hereinafter referred to as devices:

This document is used to determine if a device is burning due to internal heating caused by an overload:

2 Normative references

This document has no normative references:

3 Terms and Definitions

This document does not have terms and definitions that need to be defined:

4 Test procedure

The device should be operated without a heat sink in an atmospheric environment, and the internal power dissipation should be slowly increased from the maximum rating until a drop occurs:

List any status:

a) The internal power dissipation reaches 5 times the maximum rated power dissipation at 25°C: In this case, the power shall be kept at least

1min;

b) The device is open-circuited, short-circuited, or the resistance of the device rises to such an extent that the internal power dissipation cannot be further increased;

c) The device burns:

Only when the device is smoldering or burning, should it be considered a device failure: