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GB/T 48099-2026Lid with preform for semiconductor packages (English PDF)

半导体封装用带预制焊环盖板

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Also coversGB/T48099-2026 + GBT48099-2026

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

August 28, 2026

Implementation date

March 1, 2027

Scope

GB/T 48099-2026 is the English-translated version of 半导体封装用带预制焊环盖板.

This standard concerns lids with a preformed solder ring, used for sealing semiconductor packages. Such lids are supplied with solder already in place, so that a package can be closed in a controlled soldering step.

The document will matter to producers of package lids and sealing components, manufacturers of semiconductor packages, device makers who buy lids and need agreed product definitions, and incoming-inspection or testing laboratories. It is particularly of interest to suppliers serving the electronics components industry, where lids and packages are bought and specified separately from the devices they enclose. It is a recommended (voluntary) national standard taking effect on 1 March 2027, prepared under the Ministry of Industry and Information Technology. A shared definition of the lid and its solder preform helps buyers and suppliers agree on what is delivered before assembly begins.

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Document preview — GB/T 48099-2026

National Standard of the People's Republic of China

ICS: 31.030
Classification: L90

Issued by: State Administration for Market Regulation; Standardization Administration of China

Foreword
1 Scope
2 Normative references
3 Terms and definitions

Foreword

GB/T 48099-2026 is a recommended national standard (GB/T) of the People's Republic of China, issued on 28 August 2026 by the State Administration for Market Regulation and the Standardization Administration of China, with effect from 1 March 2027.

It is under the responsibility of the Ministry of Industry and Information Technology (Electronics).

Classification: ICS 31.030; CCS L90.

1 Scope

Remaining clauses in the full document

2 Normative references
3 Terms and definitions

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 48 pages — is available in the English PDF.

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