GB/T 47768-2026Micro-electromechanical systems (MEMS) technology - Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) (English PDF)

1 Scope 1

2 Normative References 2

3 Terms, Definitions, Symbols, and Abbreviations 2

3.1 Terms and Definitions 2

3.2 Symbol 2

4 Principle 2

5 Experimental Apparatus 3

5.2 Actuator 3

5.3 Force Sensor 3

5.4 Installation Alignment 3

5.5 Data Acquisition 3

6 Specimens 3

6.1 Specimen Design 3

6.2 Determination and Verification of Specimen Geometry 5

7 Loading Unit 5

8 Test conditions 6

8.1 Loading speed 6

8.2 Specimen Alignment 6

10 Test Reports 8

References 9

This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1: Structure and Drafting Rules of Standardization Documents".

Drafting.

This document is equivalent to IEC 62047-27:2017 "Semiconductor devices – Microelectromechanical devices – Part 27: Glass paste bonding strength".

"Measurement Method of Miniature V-Shaped Test (MCT)" the following minimal editorial changes have been made to this document.

---To harmonize with existing national standards, the standard name has been changed to "Bond Strength of Glass Slurry in Microelectromechanical Systems (MEMS) Technology".

Miniature V-T Test (MCT) Measurement Method.

Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents.

This document was proposed and is under the jurisdiction of the National Technical Committee on Standardization of Microelectromechanical Systems (SAC/TC336).