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GB/T 45719-2025Semiconductor devices - Hot carrier test on metal-oxide semiconductor (MOS) transistors (English PDF)

半导体器件 金属氧化物半导体(MOS) 晶体管的热载流子试验

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Issued by

State Administration for Market Regulation, China National Standardization Administration

Level / Type

National · Recommended

Issue date

May 30, 2025

Implementation date

September 1, 2025

Scope

GB/T 45719-2025 is the English-translated version of 半导体器件 金属氧化物半导体(MOS) 晶体管的热载流子试验.

GB/T 45719-2025 is the Chinese national wafer-level hot carrier test for NMOS and PMOS transistors, used to find out whether the individual transistors a process turns out meet the lifetime required against hot carrier injection.

It covers the test structure, the stress time and stress conditions, the sample size, the temperature, the failure criteria, the method for assessing lifetime, the lifetime requirements and what the report must say.

Among the quantities it fixes symbols for are transconductance and its maximum, substrate current, drain-source and saturated drain-source current, gate current, gate length and effective channel length, and the body-source, drain-source and gate-source voltages.

Semiconductor makers and reliability laboratories use it. It is equivalent to IEC 62416:2010, was issued on 30 May 2025 and has applied since 1 September 2025.

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Document preview — GB/T 45719-2025

National Standard of the People's Republic of China

ICS
31.080.01
Classification
L 40

Issued by: State Administration for Market Regulation, China National Standardization Administration

Contents

  • Preface
  • 1 Scope
  • 2 Normative references
  • 3 Terms and Definitions
  • 4 Symbols and abbreviations
  • 5 Test Structure
  • 6 Stress time
  • 7 Stress conditions
  • 8 Sample size
  • 9 Temperature
  • 10 Failure criteria
  • 11 Lifetime Assessment Method
  • 12 Lifetime requirements
  • 13 Report
  • References

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.

This document is equivalent to IEC 62416:2010 "Hot carrier test for MOS transistors in semiconductor devices".

This document adds two chapters. "Normative References" and "Terms and Definitions". The following minimal editorial changes were made to this document.

--- In order to coordinate with the existing standards, the name of the standard is changed to "Thermal Carrier Experiment.

1 Scope

This document describes a hot carrier test method for NMOS and PMOS transistors at the wafer level. The purpose of this test is to determine the Whether the individual transistors in the process meet the required lifetime of hot carrier injection effects.

2 Normative references

This document has no normative references.

3 Terms and definitions

There are no terms or definitions that require definition in this document.

4 Symbols and abbreviations

The following symbols and abbreviations apply to this document.

(C)MOS. Complementary MOS. gm(µA/V). transconductance of MOS transistor. gm,max(µA/V). Maximum transconductance of MOS transistor. gm,max(MOST). gm,max(L=W) of square MOS transistor. Ib (µA). substrate current of MOS transistor. Ids(µA). drain-source current of MOS transistor.

Ids,sat (µA). saturated drain-source current when Vgs = Vds = Vds,use_max; measured without changing the source and drain during stress.

Ids,sat_forward is measured, and Ids,sat_reverse is measured under the condition of changing the positions of the source and drain. Ig(nA). Gate current of MOS transistor. L(µm). The length of the gate of a MOS transistor. L(MOST). The length of a square MOS transistor (L=W).

Leff (µm). The effective electrical channel length of a MOS transistor. For a given channel length L, Leff is determined by the large square MOS transistor. gm,max is determined (W=L much greater than Lnominal). Lnominal (µm). The minimum length allowed by process design rules. MOS. Metal Oxide Semiconductor. NMOS. n-channel MOS transistor. PMOS. p-channel MOS transistor. tau(s)T. Lifetime of MOS transistor. Vbs(V). Body-source voltage of MOS transistor. Vds(V). drain-source voltage of MOS transistor. Vgs(V). Gate-source voltage of MOS transistor.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 24 pages — is available in the English PDF.

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