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GB/T 44796-2024Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation (English PDF)

集成电路三维封装带凸点圆片划片工艺过程和评价要求

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

October 26, 2024

Implementation date

May 1, 2025

Scope

GB/T 44796-2024 is the English-translated version of 集成电路三维封装带凸点圆片划片工艺过程和评价要求.

GB/T 44796-2024 is the Chinese national standard covering the step that separates finished dies from a bumped wafer of 12 inches or less — the dicing machine and the tapes it works with, the flow from film mounting through laser pre-cutting, sawing, cleaning and UV release of the tape, the labelling, packaging and records, and the evaluation applied after each step, since a chipped or contaminated die is only found once it is already inside a stack. Companion to the wafer thinning standard GB/T 44791-2024 and the die stacking standard GB/T 44775-2024, which cover the neighbouring steps of the same line. First edition, under the Ministry of Industry and Information Technology. In force from 1 May 2025. Issued on 26 October 2024, it has been in force since 1 May 2025.

Document preview — GB/T 44796-2024

National Standard of the People's Republic of China

ICS: 31.200
Classification: L 55

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

PrefaceIII
1 Scope1
2 Normative references1
3 Terms and Definitions1
4 General Requirements1
4.1 Equipment, instruments and fixtures1
4.2 Materials2
4.3 General Notes2
5 Detailed requirements3
5.1 Environment3
5.2 Typical process flow3
5.3 Process Preparation4
5.4 Film4
5.5 Peeling off the protective film5
5.6 Drying (if necessary)5
5.7 Laser pre-cutting (if necessary)5
5.8 Dicing5
5.9 Cleaning5
5.10 UV degumming (if necessary)6
5.11 Labelling, transport and storage6
5.12 Packaging6
5.13 Record6
6 Evaluation Requirements6
6.1 Evaluation requirements for protective film (if necessary)7
6.2 Evaluation requirements for scribing films7
6.3 Evaluation requirements for peeling off protective film7
6.4 Evaluation requirements for laser pre-cutting7
6.5 Evaluation requirements for dicing7
6.6 Evaluation requirements for cleaning8

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.

Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.

This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China.

This document is under the jurisdiction of the National Technical Committee for Standardization of Integrated Circuits (SAC/TC599).

This document was drafted by the 58th Research Institute of China Electronics Technology Group Corporation and Shenzhou Loongson Intelligent Technology Co., Ltd.

The main drafters of this document are Yuan Shiwei, Li Shouwei, Ji Yong, Yin Qin, Ren Yunfei, and Zheng Weihua.

Integrated circuit 3D packaging wafer with bumps scribing process Process and evaluation requirements

1 Scope

This document specifies the scribing process for 12in and below integrated circuit 3D packaged bump wafers (hereinafter referred to as scribing process).

General requirements, detailed requirements and evaluation requirements. Note. 1 in = 2.54 cm.

This document is applicable to the scribing process of bumped wafers for integrated circuit 3D packaging with a size of 12 inches or less.

2 Normative references

GB/T 25915.1-2021

3 Terms and Definitions

The following terms and definitions apply to this document.

3.1 Bumpwafer

The external lead ends of the chip are wafers with bumps.

3.2 wafer-sawing

The process of separating the chip from the wafer by physical means.

4 General requirements

4.1 Equipment, instruments and fixtures

The equipment and instruments required for the dicing process should be regularly inspected and calibrated. The fixtures should be intact and clean, and the specifications and dimensions should be consistent with the process requirements.

In order to adapt to the requirements, commonly used equipment, instruments and fixtures should meet the requirements of Table 1.

Table 1 Commonly used equipment, instruments and fixtures Serial No. Name Main Technical Requirements Application

1 Dicing Machine

Slicing size. 12in and below bump wafer Cutting speed. 0.1mm/s~300mm/s Spindle speed. 6000r/min~60000r/min Cumulative error. Scribing length >= 310mm, cumulative error <= 5µm Cutting accuracy. ±5µm

......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.

Referenced standards

Normative references

GB/T 25915.1-2021

Editions of GB/T 44796

Edition	Title	Revision	Status
GB/T 44796-2024	Integrated circuit 3D packaging - Requirement for bumping-wafer-sawing process and evaluation	current edition	Current

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