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GB/T 44631-2024Requirements for wafer carrier handoff parallel I/O interface (English PDF)

晶片承载器传输并行接口要求

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

September 29, 2024

Implementation date

April 1, 2025

Scope

GB/T 44631-2024 is the English-translated version of 晶片承载器传输并行接口要求.

GB/T 44631-2024 is the Chinese national standard covering the parallel handshake between a load port and the vehicle that brings a wafer carrier to it — the signal definitions and the load port signal configuration, the transmission timing and the load, unload, synchronous and continuous transfer sequences, the exception types, their detection and recovery, the connector, its electrical parameters, pin assignment and signal isolation, and the sensors that tell the port a carrier is seated before the handoff completes. First edition, in force from 1 April 2025. Issued on 29 September 2024, it has been in force since 1 April 2025.

Document preview — GB/T 44631-2024

National Standard of the People's Republic of China

ICS: 31.260
Classification: L 97

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

PrefaceIII
1 Scope1
2 Normative references1
3 Terms and Definitions1
4 Abbreviations2
5 Parallel interface signal3
5.1 Transmit Parallel Interface Signal Definition3
5.2 Load port signal configuration7
6 Signal Transmission Requirements9
6.1 Transmission Timing9
6.2 Single transfer sequence (loading/unloading)14
6.3 Synchronous Transfer Sequence (Loading)19
6.4 Continuous Transmission Order21
7 Exception Handling23
7.1 Exception Types23
7.2 Anomaly Detection23
7.3 Abnormal Recovery24
8 Connector type, signal, pin requirements25
8.1 Connector Type25
8.2 Signal electrical parameters26
8.3 Status Bit Assignment26
8.4 Pin Assignment27
8.5 Signal Isolation30
9 Sensor Requirements32

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.

Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.

This document was proposed and coordinated by the National Technical Committee for Semiconductor Equipment and Materials Standardization (SAC/TC203).

This document was drafted by: Beijing North Huachuang Microelectronics Equipment Co., Ltd., China Electronics Technology Standardization Institute, Zhangzhou Tailong Ming Engineering Co., Ltd. and Zhejiang Zhongju Materials Co., Ltd.

The main drafters of this document are: Cheng Chaoyang, Tian Tao, Zhao Junsha, Sun Yan, Cao Kewei, Wu Yiran, Li Ying, Zhong Jieshi, Zhang Baoshuai, Li Dianpu, Cai Shuyi, Wang Kai, Guo Xunrong, Liu Xueqing, Wu Xiaojuan.

Wafer carrier transmission parallel interface requirements

1 Scope

This document specifies the signal definitions, signal transmission requirements, exception handling, and Connector and sensor requirements.

This document applies to the field of semiconductor manufacturing and is used for the automatic transfer of wafer carriers between active and passive equipment. operate.

2 Normative references

GB/T 15125-1994

3 Terms and definitions

The following terms and definitions apply to this document.

3.1 Wafer carrier wafercarrier

Wafer racks, cassettes, boats and other carriers for storing wafers.

3.2 Storage stack stocker

A storage device used to temporarily store wafer carriers or wafers in a semiconductor production line.

3.3 Small car

A kind of automatic transporter with vertical lifting and transfer device suspended under the aerial transmission track in the semiconductor production line.

3.4 Overhead shuttle

A semiconductor production line is installed on an aerial transmission track, using a transfer robot to move the wafer carrier between devices.

Automatic transport vehicle for transmission.

3.5 Rail-guided vehicle

A semiconductor production line that runs on a ground transfer track and uses a transfer robot to transfer wafer carriers between devices. Automatic transport vehicle.

3.6

A semiconductor production line that runs on the ground without mechanical guidance and uses a transfer robot to move the wafer carrier between devices.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 32 pages — is available in the English PDF.

Referenced standards

Normative references

GB/T 15125-1994

Editions of GB/T 44631

Edition	Title	Revision	Status
GB/T 44631-2024	Requirements for wafer carrier handoff parallel I/O interface	current edition	Current

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