GB/T 44375-2024Requirements for load ports of 300mm semiconductor equipment (English PDF)

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting is required.

Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.

This document was proposed and coordinated by the National Technical Committee for Standardization of Semiconductor Equipment and Materials (SAC/TC 203).

This document was drafted by: Shanghai Microelectronics Equipment (Group) Co., Ltd., China Electronics Technology Standardization Institute, Beijing North Huachuang Microelectronics Equipment Co., Ltd., Advanced Micro-Semiconductor Equipment (Shanghai) Co., Ltd., Zhangzhou Tailong Lighting Engineering Co., Ltd., Shenzhen City Axin Semiconductor Technology Co., Ltd., Suzhou Mega Technology Co., Ltd., and China Electronics Pengcheng Intelligent Equipment Co., Ltd.

The main drafters of this document are: Hu Songli, Li Yunfeng, Wu Yiran, Cao Kewei, Zhao Junsha, Zhou Xiaofeng, Li Dianpu, Wu Xiaojuan, Zhu Ming, Li Ying, Zhang Baoshuai, Hong Feng, Zhang Zhiyong, Qiao Zhixin, and Wang Mingxin.

300 mm Semiconductor Equipment Loadport Requirements

1 Scope

This document specifies the dimensional requirements for the loading port of 300 mm wafer semiconductor equipment, mainly including the physical and chemical connection between the semiconductor equipment and the production line. Management interface.

This document is applicable to the field of semiconductor equipment design and manufacturing.

2 Normative references

This document has no normative references.

3 Terms and definitions

The following terms and definitions apply to this document.