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GB/T 44081-2024Thermal runaway test for bypass diode applied in photovoltaic modules (English PDF)

光伏组件用旁路二极管热失控测试

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Issued by

State Administration for Market Regulation, China National Standardization Administration

Level / Type

National · Recommended

Issue date

May 28, 2024

Implementation date

December 1, 2024

Scope

GB/T 44081-2024 is the English-translated version of 光伏组件用旁路二极管热失控测试.

GB/T 44081-2024 is the Chinese national standard for the thermal runaway test of bypass diodes used in photovoltaic modules, and it is equivalent to IEC 62979:2017.

It describes a test method for checking whether a bypass diode and its junction box can cope with the heat generated when the diode switches from forward to reverse bias without overheating.

The test applies to Schottky diodes, because their leakage current rises with reverse bias voltage at high temperature. Modules using PN junction diodes do not need this test, as these diodes tolerate reverse bias well.

The clauses cover test conditions, sample preparation, equipment, the test method, pass and fail criteria and the report. Issued on 28 May 2024 and applicable from 1 December 2024, it replaces no earlier edition.

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Document preview — GB/T 44081-2024

National Standard of the People's Republic of China

ICS
27.160
Classification
F 12

Issued by: State Administration for Market Regulation, China National Standardization Administration

Contents

  • Preface
  • 1 Scope
  • 2 Normative references
  • 3 Terms and Definitions
  • 4 Thermal runaway test
  • 4.1 Diode Thermal Runaway
  • 4.2 Test conditions
  • 4.3 Sample preparation
  • 4.4 Test equipment
  • 4.5 Test method
  • 5 Determination of pass and fail
  • 6 Test Report

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.

This document is equivalent to IEC 62979:2017 "Photovoltaic module bypass diode thermal runaway test". The following minimal editorial changes were made to this document.

--- To coordinate with the existing standards, the document name is changed to "Thermal runaway test of bypass diodes for photovoltaic modules".

1 Scope

This document describes a test method for thermal runaway of bypass diodes used in photovoltaic modules.

Are bypass diodes in PV modules prone to thermal runaway, or are the junction boxes too hot to handle the heat when switching from forward bias to reverse bias? capacity to prevent the diode from overheating.

This document is applicable to the testing of Schottky diodes, because Schottky diodes have the characteristic that the leakage current increases with the reverse bias voltage at high temperature. This characteristic makes Schottky diodes prone to thermal runaway.

The samples using PN junction diodes as bypass diodes do not need to be subjected to the thermal runaway test method required by this document because the PN junction Diodes have a strong ability to withstand reverse bias.

2 Normative references

The contents of the following documents constitute the essential clauses of this document through normative references in this document.

For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to This document.

3 Terms and definitions

For the purposes of this document, the following terms and definitions are applicable.

3.1 Reverse current

A current that flows through a bypass diode in a direction opposite to the diode's polarity.

3.2 Reverse bias voltage

A voltage applied across a bypass diode that is opposite in polarity to that of the diode.

3.3 Tlead

Thermocouples measure the temperature of the bypass diode leads.

4 Thermal runaway test

4.1 Diode Thermal Runaway

Some bypass diodes in photovoltaic modules have the characteristic that the leakage current increases with the temperature in the reverse bias state.

When the diode is reverse biased, the temperature is already very high, and there may be a large reverse current inside the diode.

The reverse current can cause the diode junction temperature to rise significantly. When the temperature rise exceeds the heat dissipation capacity of the junction box, this temperature rise and reverse current can cause The bypass diode fails. This phenomenon is called "thermal runaway". Therefore, the thermal design of the bypass diode in the PV module junction box should be carried out.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 7 pages — is available in the English PDF.

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