GB/T 33768-2017Reliability test method for optoelectronic devices used in telecommunications (English PDF)
通信用光电子器件可靠性试验方法
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
May 31, 2017
Implementation date
December 1, 2017
Scope
GB/T 33768-2017 is the English-translated version of 通信用光电子器件可靠性试验方法.
GB/T 33768-2017 is the set of reliability test methods for the optoelectronic devices used in telecommunications, giving for each test its purpose, equipment, conditions, procedure, inspection and failure criteria, in four types.
Compliance tests cover the photoelectric characteristics, the dimensions and the external appearance. Mechanical integrity tests run from mechanical shock, variable frequency vibration and thermal shock to fibre torque and lateral tension, pin firmness, connector insertion durability and force transmission.
Environmental tests cover high and low temperature storage, temperature cycling, damp heat, moisture resistance cycling and high temperature life; physical characteristics tests cover internal water vapour content, sealing, ESD threshold and immunity, chip shear force, solderability, bond strength and flammability.
It also sets the sampling plan and the test report, and cites GB/T 19001 and GB/T 21194. Issued on 31 May 2017, it has applied since 1 December 2017.
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Document preview — GB/T 33768-2017
National Standard of the People's Republic of China
- ICS
- 33.180.20
- Classification
- M 31
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- Preface
- 1 Scope
- 2 normative reference document
- 3 Terms and definitions
- 4 General requirements
- 4.1 Test Type
- 4.2 Test equipment
- 4.3 Test environment
- 4.4 Sampling plan
- 4.5 Test Report
- 5 detailed requirements
- 5.1 Compliance test
- 5.1.1 photoelectric characteristics
- 5.1.2 Dimensions
- 5.1.3 External visual inspection
- 5.2 Mechanical integrity test
- 5.2.1 Mechanical shock
- 5.2.2 Variable frequency vibration
- 5.2.3 Thermal shock
- 5.2.4 Fiber torque
- 5.2.5 Fiber lateral tension
- 5.2.6 Fiber Rally
- 5.2.7 pin firmness
- 5.2.8 Connector insertion and durability
- 5.2.9 Force transmission
- 5.3 Environmental tests
- 5.3.1 High temperature storage
- 5.3.2 Low temperature storage
- 5.3.3 Temperature cycle
- 5.3.4 constant hot and humid
- 5.3.5 Moisture resistant cycle
- 5.3.6 High temperature life
- 5.4 Physical Characteristics Test
- 5.4.1 Internal water vapor content
- 5.4.2 Sealing
- 5.4.3 ESD threshold
- 5.4.4 ESD immunity
- 5.4.5 Chip Shear Force
- 5.4.6 Solderability
- 5.4.7 Wire bonding strength
- 5.4.8 Flammability
- Reference
Foreword
This standard is drafted in accordance with the rules given in GB/T 1.1-2009.
1 Scope
This standard specifies the terms and definitions of the reliability test method for optoelectronic devices for communications, general requirements, detailed requirements, including test Purpose, equipment, conditions, procedures, inspection and failure criteria.
This standard applies to communications optoelectronic devices, other areas of optoelectronic devices can also refer to the use.
2 Normative reference documents
The following documents are indispensable for the application of this document. For dated references, only the dated edition applies to this document. For undated references, the latest edition (including all modifications) applies to this document.
GB/T 19001 quality management system requirements
GB/T 21194 General requirements for reliability of optoelectronic devices for communications equipment
3 Terms and definitions
The following definitions and definitions as defined in GB/T 21194 apply to this document.
3.1 Optoelectronic devices
Elements with photoelectric properties.
Note: including but not limited to laser diodes, light-emitting diodes, photodiodes, avalanche photodiodes and their components or modules, collectively referred to as "photoelectric Sub-device ".
3.2 Sample
A sample of optoelectronic devices used as a reliability test.
3.3 Failure
When the optoelectronic device does not meet the specified photoelectric parameters and/or physical parameters, it is called failure.
3.4 Failure criterion
Determine the basis for failure of optoelectronic devices.
4 General requirements
4.1 Test type
Test types include. compliance test, mechanical integrity test, environmental test and physical characteristics of the test.
4.2 Test equipment
The test equipment should be maintained and calibrated on a regular basis. The maintenance, calibration and control of the test equipment shall comply with the relevant provisions of GB/T 19001.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 34 pages — is available in the English PDF.
Referenced standards
Normative references
Similar standards
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Related Standards
GB/T 19001-2016 — Quality management systems -- Requirements
GB/T 21194-2007 — Generic reliability assurance requirements for optoelectronic devices used in telecommunications equipment
GB/T 7251.4-2026 — Low-voltage switchgear and controlgear assemblies - Part 4: Particular requirements for assemblies for construction sites (ACS)
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