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GB/T 26070-2010Characterization of subsurface damage in polished compound semiconductor wafers by reflectance difference spectroscopy method (English PDF)

化合物半导体抛光晶片亚表面损伤的反射差分谱测试方法

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Issued by

SAMR; SAC

Level / Type

National · Recommended

Issue date

January 10, 2011

Implementation date

October 1, 2011

Scope

GB/T 26070-2010 is the English-translated version of 化合物半导体抛光晶片亚表面损伤的反射差分谱测试方法.

GB/T 26070-2010 is the Chinese standard "Characterization of subsurface damage in polished compound semiconductor wafers by reflectance difference spectroscopy method".

Its scope clause reads: standard specifies the test method III-V compound semiconductor single crystal polished subsurface damage. This standard applies to GaAs, InP (GaP, GaSb can be reference) and other compound semiconductor single crystal polished subsurface damage measuring. Its clauses include definitions.

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Document preview — GB/T 26070-2010

National Standard of the People's Republic of China

ICS
77.040.99
Classification
H 17

Issued by: State Administration for Market Regulation; Standardization Administration of the PRC

Contents

  • 1 Scope
  • 2 Definitions
  • 2.1 Terms and Definitions
  • 2.2 Symbol

1 Scope

1.1

standard specifies the test method III-V compound semiconductor single crystal polished subsurface damage.

1.2

This standard applies to GaAs, InP (GaP, GaSb can be reference) and other compound semiconductor single crystal polished subsurface damage measuring.

2 Definitions

2.1 Terms and Definitions

The following terms and definitions apply to this document.

2.1.1 Subsurface damage

After the semiconductor crystal by cutting, grinding, polishing and other processing techniques, within a distance of about polished surface of the sub-micron range, part of the integrity of the crystal will

Damaged, there is a very thin (thickness is generally several tens to hundreds of nanometers) damage layer, in which there is a lot of dislocations, lattice distortion, etc. missing trap. The damaged layer called sub-surface damage layer.

2.1.2 Photoelastic effect

When there is stress or strain elastic medium, the dielectric constant or the refractive index of the medium change. Change the dielectric constant or refractive index

Variable closely related strain and applied stress. Anisotropic stress or strain will cause the dielectric function or refractive index anisotropy appears, guide

Organic crystal material appears optical anisotropy (birefringence, dichroism).

2.1.3 Optically anisotropic

When the optical properties of the material varies with the direction of propagation and the polarization state of the light, this material is said to have optical anisotropy.

2.1.4 Linearly polarized light

Vibration of the electric vector is always in a fixed plane of linearly polarized light is called.

2.1.5 Reflection difference spectrum reflectancedifferencespectroscopy, RDS

Measured near normal incidence conditions, the relative difference between the two orthogonal polarization of the incident light beam reflection coefficient with wavelength change is reflected poor

Spectrum points.

2.2 Symbol

The following symbols apply to this document.

2.2.1

deltar/r

The test crystalline material relative differences in two axis directions of the optical anisotropy of the reflection coefficient, i.e. differential reflection signal.

2.2.2

Reflectance measured crystal material.

GB/T 24582-2023 | GB/T 14849.1-2020 | GB/T 14849.3-2020 | GB/T 47080-2026 | GB/T 26074-2010 | GB/T 26067-2010 | […]

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.

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