YS/T 819-2012High-purity sputtering copper target used in electronic film (English PDF)
电子薄膜用高纯铜溅射靶材
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Issued by
Ministry of Industry and Information Technology
Level / Type
National · Recommended
Issue date
November 7, 2012
Implementation date
March 1, 2013
Scope
YS/T 819-2012 is the English-translated version of 电子薄膜用高纯铜溅射靶材.
YS/T 819-2012 — This standard specifies the electronic film with a high copper sputtering targets requirements, test methods, inspection rules and signs, packaging, transportation, storage, quality Certificates and the amount of the contract (or purchase order) content.
This standard applies to all types of high copper sputtering targets used in the manufacture of electronic film (hereinafter referred to as high-pure copper target).
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Document preview — YS/T 819-2012
National Standard of the People's Republic of China
- ICS
- 77.150.30
- Classification
- H 62
Issued by: Ministry of Industry and Information Technology
Contents
- What this standard covers1
- Document data2
- Standards quoted by this document3
What this standard covers
This standard specifies the electronic membrane with a high copper sputtering target requirements, test methods, inspection rules and signs, packaging, transportation, storage, quality certificates and contracts (or orders) content. This standard applies
Document data
International classification (ICS): 77.150.30.
Chinese classification (CCS): H62.
Estimated length of the Chinese original: 9,954 words.
Standards quoted by this document
GB/T 14265; GJB 1580A; YS/T 347; YS/T 837
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 7 pages — is available in the English PDF.
Referenced standards
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Related Standards
GB/T 14265-2017 — General rule of chemical analysis for hydrogen,oxygen,nitrogen,carbon and sulfur in metallic materials
YS/T 1115.10-2026 — Chemical analysis methods of copper, lead and zinc ores and tailings - Part 10: Determination of gold, silver, molybdenum, arsenic, tungsten, bismuth, gallium, indium, thallium, selenium, tellurium and germanium contents - Inductively coupled plasma mass spectrometry
YS/T 1115.7-2026 — Methods for chemical analysis of copper, lead, zinc ores and tailings - Part 7: Determination of molybdenum content - Thiocyanate spectrophotometric method
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YS/T 819-2012
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