YS/T 1105-2016Silver bonding wire for semiconductor package (English PDF)
半导体封装用键合银丝
YS/T 1105 | Evolution and historical versions
| Std ID | Title | Status |
|---|---|---|
| YS/T 1105-2024 | Silver bonding wire for semiconductor package | Valid |
| YS/T 1105-2016 | Silver bonding wire for semiconductor package | Obsolete |
YS/T 1105-2016 is obsolete. It has been replaced by YS/T 1105-2024. This page sells the obsolete edition, for projects and contracts that still cite it.
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Issued by
Ministry of Industry and Information Technology
Level / Type
National · Recommended
Issue date
April 5, 2016
Implementation date
September 1, 2016
Scope
YS/T 1105-2016 is the English-translated version of 半导体封装用键合银丝.
YS/T 1105-2016 is the Chinese industry standard "Silver bonding wire for semiconductor package". It was issued on April 5, 2016 by the Ministry of Industry and Information Technology, and took effect on September 1, 2016. It is obsolete: it has been replaced by YS/T 1105-2024.
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Document preview — YS/T 1105-2016
National Standard of the People's Republic of China
Issued by: Ministry of Industry and Information Technology
Contents
- Document data
1 Document data
Sector: National Recommended (industry standard).
Issuing body: Ministry of Industry and Information Technology.
Date of issue: 2016-04-05.
Date of implementation: 2016-09-01.
Status: obsolete, replaced by YS/T 1105-2024.
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — all pages — is available in the English PDF.
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YS/T 1105-2016
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