SJ 20897-2003Specification for coating process of poly-para-xylylene vapour deposition (English PDF)
聚对二甲苯气相沉积涂敷工艺规范
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Issued by
Ministry of Industry and Information Technology of PRC
Level / Type
National · Mandatory
Issue date
December 15, 2003
Implementation date
March 1, 2004
Scope
SJ 20897-2003 is the English-translated version of 聚对二甲苯气相沉积涂敷工艺规范.
SJ 20897-2003 — This standard specifies the printed circuit board assembly with parylene coating for the three anti-, vapor deposition of parylene coating requirements.
This standard applies to the printed circuit board assembly with parylene coating for protection.
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Document preview — SJ 20897-2003
National Standard of the People's Republic of China
- ICS
- 87.020
- Classification
- A 29;L30
Contents
- What this standard covers1
- Document data2
What this standard covers
This standard specifies the printed circuit board assembly with parylene coating for the three anti-, vapor deposition of parylene coating requirements. This standard applies to the printed circuit board assembly with parylene coating for protection. This standard does not apply to GJB 2142-1994 in GP, ??GR, GT, GX, GY, TFE CCL production of printed circuit board assemblies.
Document data
International classification (ICS): 87.020.
Chinese classification (CCS): A29;L30.
Estimated length of the Chinese original: 11,180 words.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 7 pages — is available in the English PDF.
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SJ 20897-2003
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