SJ 20883-2003Cleaning process method for welded PCB assembles (English PDF)
印制电路组件装焊后的清洗工艺方法
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Issued by
Ministry of Industry and Information Technology of PRC
Level / Type
National · Mandatory
Issue date
December 15, 2003
Implementation date
March 1, 2004
Scope
SJ 20883-2003 is the English-translated version of 印制电路组件装焊后的清洗工艺方法.
SJ 20883-2003 — This standard specifies the military electronic equipment, printed circuit board assembly cleaning process after assembly and welding methods.
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Document preview — SJ 20883-2003
National Standard of the People's Republic of China
- ICS
- 31.180
- Classification
- L 30
Contents
- What this standard covers1
- Document data2
What this standard covers
This standard specifies the military electronic equipment, printed circuit board assembly cleaning process after assembly and welding methods. This standard applies to military electronic equipment, printed circuit boards after assembly and welding components.
Document data
International classification (ICS): 31.180.
Chinese classification (CCS): L30.
Estimated length of the Chinese original: 13,166 words.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 9 pages — is available in the English PDF.
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SJ 20883-2003
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