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SJ 20882-2003Requirement for soldering technology of PCB assembles (English PDF)

印制电路组件装焊工艺要求

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Issued by

Ministry of Industry and Information Technology of PRC

Level / Type

National · Mandatory

Issue date

December 15, 2003

Implementation date

March 1, 2004

Scope

SJ 20882-2003 is the English-translated version of 印制电路组件装焊工艺要求.

SJ 20882-2003 — Requirement for soldering technology of PCB assembles

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Document preview — SJ 20882-2003

National Standard of the People's Republic of China

ICS: 31.180
Classification: L 30

What this standard covers1
Document data2

What this standard covers

This standard specifies the assembly of printed circuit assembly and welding process should follow the basic requirements and product inspection process standards. This standard applies to the printed circuit board (PCB) substrate vias as assembling components (THT), surface mount components (SMC/SMD) the loading Union.

Document data

International classification (ICS): 31.180.

Chinese classification (CCS): L30.

Estimated length of the Chinese original: 47,445 words.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 31 pages — is available in the English PDF.

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