GB/T 7423.3-1987Heat sink of semiconductor devices. Heat sink, staggered fingers shapes (English PDF)
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Issued by
National Bureau of Standards
Level / Type
National · Recommended
Issue date
March 16, 1987
Implementation date
November 1, 1987
Scope
GB/T 7423.3-1987 (Heat sink of semiconductor devices. Heat sink, staggered fingers shapes) is available as an English-translated PDF.
GB/T 7423.3-1987 — Heat sink of semiconductor devices. Heat sink, staggered fingers shapes
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Document preview — GB/T 7423.3-1987
National Standard of the People's Republic of China
- ICS
- 31.24
- Classification
- L 32
Issued by: National Bureau of Standards
Contents
- What this standard covers1
- Document data2
What this standard covers
This standard specifies the interdigital radiator model compilation methods, varieties and specifications and technical requirements.
Document data
International classification (ICS): 31.24.
Chinese classification (CCS): L32.
Estimated length of the Chinese original: 38,311 words.
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 25 pages — is available in the English PDF.
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Related Standards
GB/T 7423.1-1987 — Heat sink of semiconductor devices--Generic specification
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GB/T 7423.3-1987
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