GB/T 46280.5-2025Specification for chiplet interconnection interface — Part 5: Physical layer technical requirements based on 2.5D package (English PDF)

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.

This document is Part 5 of GB/T 46280, Chiplet Interconnection Interface Specification. GB/T 46280 has been published in the following parts.

— Part 1: General provisions;

— Part 2: Protocol layer technical requirements;

— Part 3: Data link layer technical requirements;

— Part 4: Physical layer technical requirements based on 2D packaging;

— Part 5: Physical layer technical requirements based on 2.5D packaging.

Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.

This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China.

This document is under the jurisdiction of the National Technical Committee for Standardization of Integrated Circuits (SAC/TC599).

This document was drafted by: Zhongguancun High-Performance Chip Interconnect Technology Alliance, China Electronics Technology Standardization Institute, Shenzhen HiSilicon Semiconductor Co., Ltd., Tsinghua University, Shenghejing Microsemiconductor (Jiangyin) Co., Ltd., Shenzhen ZTE Microelectronics Technology Co., Ltd., Peking University, China Mobile Communications Co., Ltd. Research Institute, Fujian Electronic Information (Group) Co., Ltd., Beijing Core Power Technology Innovation Center Co., Ltd.

Co., Ltd., China Science and Technology Integrated Circuit Co., Ltd., Shanghai Jiao Tong University, and Zhongyin Microelectronics (Nanjing) Co., Ltd.

The main drafters of this document are: Wu Huaqiang, Zhang Yuqin, Cai Jing, Yang Lei, Cui Dong, Zhou Jun, Li Xiangyu, Li Mingxuan, Wu Bo, Wang Qian, Liu Zewei, Luo Duona, Wang Shiwei, Tang Liangxiao, Li Yang, Wang Haijian, Xue Xingtao, Li Leqi, Zou Hao, Li Nan, Wang Dapeng, Jia Haikun, Wang Wei, Ye Le, Jia Tianyu, Li Xinxi, Zhang Lai, Jin Peng, Wei Jinghe, Hua Songyi, He Guanghui, Jiang Jianfei, Yuan Chun, Zhu Hongwei, Xu Hongwen, and Gao Qiang.

Introduction

Chiplet technology is a technology that integrates multiple bare chips or integrated bare chips into one through high-bandwidth interconnect interfaces and advanced packaging.

Larger chips or systems have both high performance and low cost advantages. In the post-Moore era, chiplet technology is the key to supporting the development of the high-performance computing industry. One of the key technologies.

GB/T 46280 "Chiplet Interconnection Interface Specification" aims to unify the data transmission processing mechanism of point-to-point interconnection between chiplets, and is used for different Chips from the same supplier (design unit, manufacturing unit, packaging and testing unit), with different functions and different process nodes, can achieve efficient interconnection and interoperability.

GB/T 46280 "Chiplet Interconnection Interface Specification" specifies the layered architecture of chiplet interconnection, as well as the functional requirements of each layer and the interface between layers.

The requirements are to be composed of five parts.

— Part 1: General. The purpose is to define the terms and definitions, abbreviations of the chiplet interconnection interface, and to specify the classification of the chiplet interconnection interface.

The layer architecture and basic functions of each layer are defined, and the interconnection scenarios and encapsulation types are established.

— Part 2: Protocol layer technical requirements. The purpose is to specify the protocol layer technical requirements of the chiplet interconnect interface, general SoC bus protocol, high-bandwidth storage protocol, and custom protocol.

— Part 3: Data link layer technical requirements. The purpose is to specify the data link layer technical requirements of the chiplet interconnection interface.

— Part 4: Physical layer technical requirements based on 2D packaging. The purpose is to specify the physical layer technical requirements based on 2D packaging of chiplet interconnection interface.

Technical requirements for the management layer.

— Part 5: Physical layer technical requirements based on 2.5D packaging. The purpose is to specify the physical layer technical requirements based on 2.5D packaging of chiplet interconnection interfaces.

Physical layer technical requirements.

Chiplet Interconnect Interface Specification Part 5: Physical layer based on 2.5D packaging Technical requirements

1 Scope

This document specifies the physical layer technical requirements based on 2.5D packaging, including initialization and training process, physical layer electrical characteristics, redundant The system must meet the relevant technical requirements for control, interface physical layout and low power consumption control.

This document applies to the design, manufacture and application of chiplet interconnect interfaces.

2 Normative references

GB/T 46280.1

GB/T 46280.3

3 Terms and Definitions

The terms and definitions defined in GB/T 40268.1 apply to this document.

4 Abbreviations

The following abbreviations apply to this document. AC. Alternating Current CDM. Charged Device Model DC. Direct Current DDR. Double Data Rate IO. Input/Output port LPC. Low Power Mode (LowPowerCommand)