GB/T 43798-2024Test method of positive photoresist for manufacturing of flat panel display array (English PDF)
平板显示阵列用正性光阻材料测试方法
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Issued by
SAMR; SAC
Level / Type
National · Recommended
Issue date
March 15, 2024
Implementation date
October 1, 2024
Scope
GB/T 43798-2024 is the English-translated version of 平板显示阵列用正性光阻材料测试方法.
GB/T 43798-2024 is the Chinese national standard covering test method of positive photoresist for manufacturing of flat panel display array. Issued on 15 March 2024, it has been in force since 1 October 2024.
Document preview — GB/T 43798-2024
National Standard of the People's Republic of China
- ICS
- 31.030
- Classification
- L 90
Issued by: State Administration for Market Regulation; Standardization Administration of the PRC
Contents
- PrefaceIII
- 1 Scope1
- 2 Normative references1
- 3 Terms and Definitions1
- 4 Test Conditions2
- 4.1 Environmental conditions2
- 4.2 Reagents and Materials2
- 4.3 Other Supporting Facilities2
- 5 Test Item2
- 5.1 Film Moire2
- 5.2 Exposure4
- 5.3 Exposure test to observe the integrity of the pattern6
- 5.4 Critical Dimension (CD)6
- 5.5 Residual film rate7
- 5.6 Solid content8
- 5.7 Liquid Particle Counting9
- 5.8 Viscosity10
- 5.9 Relative density11
- 5.10 Water mass fraction11
- 5.11 Metal impurity content11
- 6 Test report13
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1: Structure and drafting rules for standardization documents" Drafting.
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document was proposed and coordinated by the National Technical Committee for Semiconductor Equipment and Materials Standardization (SAC/TC203).
This document was drafted by: BOE Technology Group Co., Ltd., Shanghai Tongcheng Electronic Materials Co., Ltd., China Electronics Technology Standards Institute of Chemistry, Fuyang Xinyihua Materials Technology Co., Ltd., Jiangyin Runma Electronic Materials Co., Ltd., Fujian Hongguang Semiconductor Materials Co., Ltd. company.
The main drafters of this document are: Yang Lan, Cheng Long, Wu Yiran, Zhao Junsha, Cao Kewei, Li Lin, Wu Jingwei, Yue Shuang, Li Lu, Ge Yeming, He Ke, Zeng Chengcai and Yuan Xiaolei.
Positive photoresist materials for flat panel display arrays Test Methods
1 Scope
This document describes the test methods for positive photoresist materials used in flat panel display arrays.
This document is applicable to the performance testing of positive photoresist materials used in the manufacture of display arrays such as liquid crystal display devices and organic light-emitting display devices.
2 Normative references
GB/T 23942
GB/T 25915.1
GB/T 33087
GB/T 37403
GB/T 39486
3 Terms and definitions
The following terms and definitions apply to this document.
3.1 Exposure energy
The dose of light energy or other radiation energy absorbed per unit area of photoresist material.
Note. It is used to measure the sensitivity of photoresist materials to exposure. In optical exposure, under given exposure light intensity conditions, the sensitivity is usually adjusted by the exposure time. Exposure.
3.2 Substrate
Substrate material for photoresist coating.
Note. In this document, the substrate wafer may be a single crystal silicon wafer, an epitaxial silicon wafer, or a glass wafer for a flat panel display, etc.
3.3 Softbake/prebake
After the photoresist material passes through the coating process, the solvent in the photoresist film is evaporated through an oven or hot plate to form the adhesive required for the exposure process. Membrane process.
3.4 Hardbake
The photoresist material is baked in an oven or hot plate after being coated, pre-baked, exposed and developed.
Note. The solvent in the photoresist film is further evaporated so that it can be used in subsequent processes.
3.5 coating film mura
The uneven thickness or density of the photoresist material, the presence of foreign matter in the photoresist material, the unstable coating process, etc. may cause the film surface to form
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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 15 pages — is available in the English PDF.
Referenced standards
Normative references
- GB/T 23942Chemical reagent - General rules for inductively coupled plasma atomic emission spectrometry
- GB/T 33087Ultra pure water for instrumental analysis specification and test methods
- GB/T 37403Tetramethylammonium hydroxide developer for thin film transistor-liquid crystal display(TFT-LCD)
- GB/T 39486Chemical reagent—General rules for inductively coupled plasma mass spectrometry
GB/T 25915.1
Editions of GB/T 43798
| Edition | Title | Revision | Status |
|---|---|---|---|
| GB/T 43798-2024 | Test method of positive photoresist for manufacturing of flat panel display array | current edition | Current |
This page sells the current edition, GB/T 43798-2024. Earlier editions are listed for reference only.
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Related Standards
GB/T 23942-2009 — Chemical reagent - General rules for inductively coupled plasma atomic emission spectrometry
GB/T 33087-2016 — Ultra pure water for instrumental analysis specification and test methods
GB/T 37403-2019 — Tetramethylammonium hydroxide developer for thin film transistor-liquid crystal display(TFT-LCD)
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