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GB/T 20870.10-2023Semiconductor devices - Part 16-10: Technology Approval Schedule for monolithic microwave integrated circuits (English PDF)

半导体器件第16-10部分：单片微波集成电路技术可接收程序

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Issued by

State Administration for Market Regulation, China National Standardization Administration

Level / Type

National · Recommended

Issue date

September 7, 2023

Implementation date

January 1, 2024

Scope

GB/T 20870.10-2023 is the English-translated version of 半导体器件第16-10部分：单片微波集成电路技术可接收程序.

GB/T 20870.10-2023 is the Chinese standard "Semiconductor devices - Part 16-10: Technology Approval Schedule for monolithic microwave integrated circuits".

Its scope clause reads: This document specifies the terminology, definitions, symbols, quality systems, testing, evaluation and design of monolithic microwave integrated circuits. pricing, verification methods, and other requirements. Its clauses include normative reference documents.

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Document preview — GB/T 20870.10-2023

National Standard of the People's Republic of China

ICS: 31.200
Classification: L 56

Issued by: State Administration for Market Regulation, China National Standardization Administration

Preface
Introduction
1 Scope
2 Normative reference documents
3 Terms, definitions and abbreviations
3.1 Units, symbols and terminology
3.2 Standard and preferred values
3.3 Terms and Definitions
3.4 Abbreviations
3.5 Definition of the scope of technically acceptable procedures
4 Definition of device technology
4.1 Scope of device technology
4.2 Activity description and flow chart
4.3 Technical Summary
4.4 Subcontractor control requirements
5 MMIC device design
5.1 Device design scope of MMIC
5.2 Activity description and flow chart
5.3 Interface
5.4 Process confirmation and control
6 Mask Manufacturing
6.1 Scope of mask manufacturing
6.2 Activity description and flow chart
6.3 Process confirmation and control
6.4 Subcontractors, suppliers and internal suppliers
7 MMIC wafer manufacturing
7.1 MMIC wafer manufacturing scope
7.2 Activity Description and Flowchart
7.3 Device
7.4 Materials
7.5 Rework
7.6 Process confirmation methods and control
7.7 Interrelationships
8 MMIC wafer testing
8.1 Scope of MMIC wafer testing
8.2 Activity Description and Flowchart
8.3 Equipment
8.4 Test Procedure
8.5 Interrelationships
9 Backside process for bare chip delivery
9.1 Scope of backside process for bare chip delivery
9.2 Activity Description and Flowchart
9.3 Device
9.4 Material
9.5 Process confirmation methods and control
9.6 Interrelationships
9.7 Validity of release
10 MMIC assembly
10.1 Scope of MMIC assembly
10.2 Activity Description and Flowchart
10.3 Materials, inspection and handling
10.4 Equipment
10.5 Rework
10.6 Process Validation and Control
10.7 Interrelationships
11 MMIC test
11.1 Scope of MMIC testing
11.2 Activity Description and Flowchart
11.3 Equipment
11.4 Test Procedure
11.5 Interface
11.6 Process Validation and Control
11.7 Process Limit Verification
11.8 Product Verification
12 Process Characterization
12.1 Identification of process characterization
12.2 Activity Description
12.3 Characterization procedure
13 Packaging and Shipping
13.1 Activity Description and Flowchart
13.2 Interface
13.3 Validity of release
14 Cancellation Technology Acceptable

1 Scope

This document specifies the terminology, definitions, symbols, quality systems, testing, evaluation and design of monolithic microwave integrated circuits.

pricing, verification methods, and other requirements.

2 Normative reference documents

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations

For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to this document.

Note. GB/T 2423 (all parts) Environmental test [IEC 60068 (all parts)] ductordevices-Part 2.Dimensions)

Note. GB/T 4728 (all parts) Graphical symbols for electrical diagrams [IEC 60617 (all parts)]

Note. GB/T 20870.1-2007 Semiconductor devices Part 16-1.Microwave integrated circuit amplifiers (IEC 60747-16-1.2001, IDT) cuits-Part 1.General)

QC001002-3.2005 IEC Quality Assessment System (IEC Q) Procedure Rules for Electronic Components Part 3.Approval Procedure (IEC Quality Assessment System for Electronic Component(IEC Q)-Rule of procedure-Part 3.

Approval procedure

GB/T 46280.2 | SJ/T 11890 | SJ/T 11891 | GB/T 42968.3 | GB/T 20870.4 | GB/T 20870.5 | […]

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 40 pages — is available in the English PDF.

Referenced standards

Normative references

GB/T 20870.1-2007Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

GB/T 2423 · GB/T 4728 · QC001002-3:2005

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