GB/T 14862-1993Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits (English PDF)
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Issued by
State Bureau of Technical Supervision
Level / Type
National · Recommended
Issue date
December 30, 1993
Implementation date
October 1, 1994
Scope
GB/T 14862-1993 (Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits) is available as an English-translated PDF.
GB/T 14862-1993 — This standard specifies the semiconductor integrated circuit package junction to case thermal resistance test methods.
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Document preview — GB/T 14862-1993
National Standard of the People's Republic of China
- ICS
- 31.2
- Classification
- L 56
Issued by: State Bureau of Technical Supervision
Contents
- What this standard covers1
- Document data2
- Standards quoted by this document3
What this standard covers
This standard specifies the semiconductor integrated circuit package junction to case thermal resistance test methods. This standard applies to semiconductor integrated circuit ceramic, metal, plastic packaging junction to case thermal resistance measurements.
Document data
International classification (ICS): 31.2.
Chinese classification (CCS): L56.
Estimated length of the Chinese original: 10,142 words.
Standards quoted by this document
GB/T 14113; GJB 548
......
This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 7 pages — is available in the English PDF.
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