GB 51037-2014Standard for construction and acceptance of micro-assembling production line process equipment installation engineering (English PDF)

1 General provisions

1.0.1 The document was drawn up to regulate the construction and the quality acceptance of installation works for micro-assembling production line process equipment, to secure the installation quality and the reliable running of that equipment, and to advance equipment installation technology in this field.

1.0.2 It applies to the construction, debugging, commissioning and acceptance of installation works for micro-assembling production line process equipment in new, rebuilt and extended projects.

1.0.3 Apart from this standard, the construction and acceptance of installation works for micro-assembling production line process equipment shall also comply with the relevant provisions of the national standards currently in force.

2 Terms

2.0.1 micro-assembling - technology in which the various miniature components, integrated circuit chips and chip components that make up an electronic circuit are assembled on a high-density multilayer interconnection substrate by surface mounting and interconnection processes, forming an advanced microelectronic assembly.

2.0.2 multilayer substrate - substrate carrying embedded conductor layers, used to realise complex interconnection circuits.

2.0.3 thick film - film layer deposited on a substrate by a screen printing process and fused into its final form after firing at a maximum temperature of about 850 °C.

2.0.4 co-fired ceramic - composite ceramic material with a range of properties, obtained by making ceramic powder into green sheets of accurate thickness and high density, forming the circuits on multiple layers of green sheets and then firing and fusing them together; it is divided into low temperature co-fired ceramic and high temperature co-fired ceramic. (Clause revised in the 2024 partial revision; formerly 2.0.4 low temperature co-fired ceramic multilayer substrate.)

2.0.4A low temperature co-fired ceramic (LTCC) - rigid multilayer interconnection ceramic part obtained by stacking in order unfired flexible green ceramic sheets that carry printed thick film conductor and resistor patterns on the surface and metallised interlayer interconnection vias, pressing them into an integral structure while heating, and then co-firing the green sheets together with the thick film electronic pastes in an air atmosphere at a temperature of 800 °C to 950 °C.

2.0.4B high temperature co-fired ceramic (HTCC) - rigid multilayer interconnection ceramic part obtained by stacking in order unfired flexible green ceramic sheets that carry printed thick film conductor and resistor patterns on the surface and metallised interlayer interconnection vias, pressing them into an integral structure while heating, and then co-firing the green sheets together with the thick film electronic pastes in a hydrogen or hydrogen-nitrogen mixed atmosphere at a temperature of 1500 °C to 1850 °C.

2.0.5 thin film - conductive, resistive or dielectric material layer formed on a co-fired ceramic substrate by vacuum evaporation, sputtering, chemical vapour deposition or similar methods, its thickness usually being less than 1 micrometre. (Clause revised in the 2024 partial revision; formerly 2.0.5 thin film multilayer substrate.)

2.0.6 green tape - strip-shaped flexible thin ceramic material made by a tape casting process, uniform in texture, smooth on the surface and of a certain strength.

2.0.7 packaging - microelectronic process technology for interconnecting, protecting and dissipating the heat of electronic devices (microcircuits or assemblies); it falls mainly into three types, plastic packaging, ceramic packaging and metal packaging.

2.0.8 process inspection - process of measuring and inspecting the shape, dimensions and position of a product and its mechanical, physical and chemical characteristics with metering or testing tools, instruments or equipment and comparing them against its technical requirements; it is the inspection technique by which, during production, the conformity of a process step or of the finished state of a product with what the design and process documents lay down is evaluated.

3.1 Construction conditions

3.1.1 Before micro-assembling equipment is installed, the clean plant shall satisfy the following provisions: (1) it shall have passed as-built acceptance in the empty state, and the air cleaning and conditioning system shall have run continuously and normally for 24 h or more; (2) the temperature should be 20 °C to 26 °C; (3) the relative humidity should be 30 % to 70 %; (4) the bearing capacity of the floor shall meet the load requirements of the equipment; (5) the clear height shall meet the installation requirements of the equipment; (6) the personnel purification facilities at the entrance of the plant shall already be in service; (7) an opening for moving equipment in shall be available; (8) the fire-fighting facilities shall have passed their special acceptance and be ready for use; (9) the antistatic facilities of the antistatic working area shall have passed test acceptance; (10) power, gas and water supplies and earthing terminals meeting the requirements shall be present; (11) a safe evacuation route for the staff shall be provided.

3.1.2 The following technical documents shall be available for the installation of micro-assembling equipment: (1) the equipment installation layout drawing; (2) the equipment packing list; (3) the technical documents on equipment installation, operation and maintenance and the installation technical parameters supplied by the equipment manufacturer.

3.1.3 Construction personnel entering the clean plant shall have obtained a pass for the clean area, and personnel in special trades shall hold the certificates required by the relevant provisions.

3.1.4 Materials for equipment installation and for piping and wiring works shall comply with the relevant provisions of the current national standard GB 50472 Code for design of clean room of electronic industry.

3.1.5 The machines and tools used for construction shall comply with the relevant provisions of the current national standard GB 50467 Code for construction and acceptance of microelectronic production equipment installation engineering.

3.2 Equipment unpacking

3.2.1 Unpacking of the equipment shall be attended jointly by responsible personnel of the equipment supplier, the construction unit and the client; for imported equipment subject to statutory commodity inspection, a customs commodity inspection representative shall attend as well.

3.2.2 Before unpacking, the packing case shall be checked for damage and for the extent of any damage, and the anti-vibration and anti-tilt indicators shall show nothing abnormal.

3.2.3 Unpacking of the equipment shall satisfy the following provisions: (1) effective opening tools shall be used and a reasonable procedure followed, without causing damage to the equipment in the case or to its accessories; (2) the top cover of the case shall be removed first, after the nails or other fasteners of the top cover have been pulled out; (3) once the top cover and part or all of the side covers have been removed, the small parts and accessories other than the main unit shall be taken out first, and the remaining unpacking work carried out afterwards.

3.2.4 The packing materials removed shall be cleared away promptly after unpacking.

3.2.5 After unpacking, the equipment inside, the inner packing and the equipment accessories shall be checked for soundness; if anything abnormal is found, a photographic record shall be made at once and proposals for dealing with it put forward.

3.2.6 After unpacking, the following checks shall be made item by item: (1) the model and specification shown on the equipment nameplate shall agree with the equipment list or the technical parameter table; (2) any defect, damage or corrosion of the appearance and of the protective packing of the equipment shall be reported promptly and recorded, and manufacturing defects shall be notified to the equipment manufacturer for study and settlement; (3) parts, components, tools, accessories, ancillary materials and other technical documents shall be counted one by one against the packing list to see whether they are complete, and a record shall be made; (4) after unpacking and checking are complete, the parts, accessories, ancillary materials, tools and fixtures and technical documents that are not to be installed or are not used during installation shall be handed over to the user unit for safe keeping.

3.2.7 An unpacking inspection record shall be filled in for the unpacking of the equipment, and its content and format shall comply with Table A.0.1 of this standard.

2024 partial revision and change of title

The copy on offer is the 2024 printing. It carries Announcement No. 107 of 2024 of the Ministry of Housing and Urban-Rural Development, dated 27 June 2024, which approves partially revised clauses of GB 51037-2014 with effect from 1 October 2024 and states that the title of the standard is changed from Code for construction and acceptance of micro-assembling production line process equipment installation engineering to Standard for construction and acceptance of micro-assembling production line process equipment installation engineering, that is, from Code (guifan) to Standard (biaozhun). The cover of this printing carries the new title; the standard number, the issue date of 27 August 2014 and the implementation date of 1 May 2015 are unchanged, and the document remains a mandatory GB standard.

The explanation of the partial revision names the changes: in Chapter 2 the term 2.0.4 was changed from low temperature co-fired ceramic multilayer substrate to co-fired ceramic and 2.0.5 from thin film multilayer substrate to thin film, both redefined; the technical scope of Chapter 4 was widened from low temperature co-fired ceramic to co-fired ceramic manufacturing process equipment in general, taking in high temperature co-fired ceramic equipment, and the chapter was renamed accordingly; clauses 4.1.4 on equipment interconnection and interoperability and 4.1.5 on process equipment system integration were added; 4.4 was renamed from green tape puncher to mechanical puncher; interconnection, interoperability and system integration requirements were added for the equipment of 4.3, 4.4, 4.5, 4.6, 4.7 and 4.8; and 4.14 integrated control system, 4.15 uncovering film machine, 4.16 automated transmission line, 4.17 frame pasting machine, 4.18 film pasting machine, 4.19 cache library, 4.20 automated guided vehicle, 4.21 drying oven, 4.22 high temperature co-fired ceramic sintering furnace and 4.23 electroplating production line were added. In Chapter 5 the installation requirements for 5.8 reactive ion etching machine and 5.9 chemical mechanical polishing machine were supplemented. In Chapter 6 clause 6.1.4 was added, 6.2 was renamed from chip die bonder to chip mounter, and full-automatic equipment was added alongside the manual and semi-automatic equipment for 6.2, 6.3 and 6.5. Revised passages are marked with an underline in the printed text.

The revision was carried out by the China Electronics Standardization Institute together with the No. 2 Research Institute of China Electronics Technology Group Corporation and other bodies, under the 2019 work plan of the Ministry of Housing and Urban-Rural Development (Jianbiaohan [2019] No. 8).

Note on the printed English wording

The English contents pages of this printing spell the ceramic process co-fined in the headings of Chapter 4 and of clause 4.11; this is a typing error for co-fired, and the table of contents above carries the corrected spelling. The Chinese text uses the term for co-fired ceramic throughout, and the English glosses printed against terms 2.0.4, 2.0.4A and 2.0.4B in Chapter 2 read co-fired ceramic, low temperature co-fired ceramic and high temperature co-fired ceramic.

The English contents of this printing were not brought into line with the 2024 partial revision. The heading of Chapter 4 still reads low temperature co-fired ceramic and thick film substrate production process equipment and clause 4.4 still reads green tape puncher, whereas the Chinese contents of the same printing read co-fired ceramic and thick film substrate manufacturing process equipment and mechanical puncher. The table of contents above reproduces the printed English headings, with the spelling corrected, and this divergence between the two languages is left as it stands in the document.