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GB 50467-2008Code for construction and acceptance of micro-electronics manufacturing equipment installation engineering (English PDF)

微电子生产设备安装工程施工及验收规范

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Issued by

Ministry of Housing and Urban-Rural Development of the People's Republic of China; General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

Level / Type

National · Mandatory

Issue date

December 15, 2008

Implementation date

July 1, 2009

Scope

GB 50467-2008 is the English-translated version of 微电子生产设备安装工程施工及验收规范.

GB 50467-2008 — This Chinese standard applies to integrated circuits, discrete semiconductor device manufacturing equipment installation engineering construction and acceptance.

This standard does not include the production of integrated circuits and discrete semiconductor devices commissioning and trial production equipment linkage.

Microelectronics production equipment installation construction documents used in engineering, contract documents and construction quality acceptance for not less than the requirements of this standard.

Microelectronics manufacturing equipment shall be installed in place construction of the approved design drawings, modify the design of the original design unit should change notification.

Instrumentation for detection shall be approved by the national legal metrology institutes certified and should be used in the test period.

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Document preview — GB 50467-2008

National Standard of the People's Republic of China

ICS
31
Classification
P 82

Issued by: Ministry of Housing and Urban-Rural Development of the People's Republic of China; General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

Contents

  • What this standard covers1
  • Document data2

What this standard covers

This Chinese standard applies to integrated circuits, discrete semiconductor device manufacturing equipment installation engineering construction and acceptance. This standard does not include the production of integrated circuits and discrete semiconductor devices commissioning and trial production equipment linkage. Microelectronics production equipment installation construction documents used in engineering, contract documents and construction quality acceptance for not less than the requirements of this standard. Microelectronics manufacturing equipment shall be installed in place construction of the approved design drawings, modify the design of the original design unit should change notification. Instrumentation for detection shall be approved by the national legal metrology institutes certified and should be used in the test period. Microelectronics production equipment installation engineering construction and acceptance in addition to the implementation of this standard, there should be consistent with existing national standards.

Document data

International classification (ICS): 31.

Chinese classification (CCS): P82.

Estimated length of the Chinese original: 72,772 words.

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This preview omits tables, figures, formulas and parts of the technical clauses. The complete document — 48 pages — is available in the English PDF.

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GB 50467-2008

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